Conference Information
Conference Name:
National Third-Generation Semiconductor Materials and Equipment Industry Conference & 3rd Semiconductor Advanced Packaging and Testing Technology Innovation Forum
Organizer: Core Semiconductor Frontier
Co-organizers:
China International Science and Technology Promotion Association Semiconductor Industry Development Branch
China Semiconductor Industry Chain Group
Conference Date: April 17
Conference Scale: 600+
Conference Venue: Wuxi Suning Hyatt Hotel
Scan the QR code to register!!!
Conference Agenda
Participating Companies
Conference Overview
Conference Topics
Keynote Report Content (including but not limited to):
Third-Generation Semiconductor Materials and Equipment
1. Technical Prospects and Application Trends of Third-Generation Semiconductor Materials and Equipment
2. Silicon Carbide Technology and Equipment
3. Gallium Nitride Technology and Equipment
4. Current Status and Challenges of Semiconductor Localisation
5. SiC, GaN Device Packaging Modules, System Solutions, and Applications
6. Ultra-Wide Bandgap Semiconductors
Semiconductor Advanced Packaging and Testing Technology
1. Advanced Packaging: Chiplet, System-in-Package (SiP), Wafer-Level Packaging (WLP), 3D/2.5D Packaging, etc.
2. Packaging Design, Modeling, and Simulation
3. Packaging Materials and Processes
4. Packaging Equipment and Processes
5. Testing and Reliability
6. Advanced Packaging Applications
Registration
Conference Sponsorship
Standard Booth:(20% discount for previous exhibitors) Includes 3 participant slots, meals, booth setup, conference materials, etc.
Note: All sponsors and exhibitors will receive Class A/B catalog benefits.
Other sponsorship opportunities include conference title sponsorship, dinner, tea breaks, chairback advertising, etc. Relevant enterprises are welcome to sponsor this forum. For detailed sponsorship plans, please contact the organizing committee.
For participation, exhibition, and sponsorship inquiries:
Jie Zhang 19285516055 (WeChat)
For media, submissions, and cooperation inquiries:
Teacher Shen 19285540996 (WeChat)
Guide Example
Payment Account
Account Name: Anhui Xinhuibang Technology Co., Ltd.
Bank: ICBC Hefei Bozhou Road Branch
Account Number: 13020 10909 20023 6740
Bank Code: 102361002393
Please indicate "Wuxi + Semiconductor Conference + Company Name" when making the payment and retain the payment receipt for verification during check-in. After successful payment, please keep your phone accessible. The organizing committee will contact you as soon as possible. Thank you for your support!
Invoice Information Submission: bandaoti2024@163.com
Note: This conference provides electronic general invoices, which will be sent to the participants' email or WeChat. The invoice content is "Conference Fee."
Note: Sponsoring enterprises should transfer the funds to the designated account within 3 working days after signing the agreement.
Hotel Introduction
Hotel Address:
Wuxi Suning Hyatt Hotel (No. 109, Renmin Middle Road, Liangxi District, Wuxi City)
Hotel Accommodation:
The organizing committee has negotiated discounted room rates at the conference hotel. Participants can enjoy the agreed rates. Due to the peak travel season in April, hotel rooms are in high demand. If you need to book accommodation, please contact the organizing committee as soon as possible!
Accommodation Standards:Single/Double Room Agreement Price: 500 yuan/room (including breakfast)
Hotel Dining:43rd Floor Sky Garden, Luxury Buffet Lunch + Fixed Dinner: 599 yuan/person
Contact: Teacher Liu 19266465582
Transportation Guide:
Wuxi Shuofang Airport: Approximately 21 km, about 30 minutes by car!
Wuxi East Railway Station (High-Speed Rail Station): Approximately 21 km, about 30 minutes by car!
Wuxi Railway Station: Approximately 3 km, about 10 minutes by car!
Nearby Subway Station: Close to Subway Line 1 and Line 2. Get off at Sanyang Plaza Station, exit from Exit 20B, and walk 2 minutes to the hotel!!!
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