Shanghai (Gasgoo)- On May 16, FAW Group and Tsinghua Unigroup signed a strategic cooperation agreement in Beijing, aiming to deepen collaboration across multiple areas of China's automotive semiconductor industry.
Under the agreement, the two parties will work together on domestic chip application, supply chain development, joint R&D initiatives, chip ecosystem construction, and market-driven collaboration.
By leveraging their respective strengths, they intend to enhance supply-demand alignment and industrial synergy.
The partnership will focus on building a robust, automotive-grade chip ecosystem encompassing chip design, wafer fabrication, packaging and testing, application selection, and integrated system solutions. Through joint projects, technological breakthroughs, and capital cooperation, the two sides aim to establish a benchmark for "chip + automotive" industry collaboration.
