I. AI Computing Expansion — Unlocking a Second Growth Curve for Tin The massive global rollout of AI infrastructure and data centers has quietly brought tin into the spotlight as the essential "Computational Solder." "Tin's low melting point (232°C), excellent electrical conductivity, and reliable joint strength make it an irreplaceable baseline material for electronic interconnects. Currently, about 53% of global refined tin is used for solders, with electronics accounting for 70% of that share. This directly covers core AI hardware components, including server chip packaging, high-speed optical modules, and PCB board-level interconnections. According to SMM, every GW of installed AI data center capacity requires approximately 1,200 to 1,500 tons of tin . The breakdown is roughly: · Servers/GPUs/Networking: 500–1,500 tons · Power and Switchgear: 100–400 tons · Control/Comms/Cooling: 50–200 tons Global AI computing installations are projected to grow at a 24% CAGR from 2025 to 2030, with a significant 65% year-over-year jump expected in 2026. The explosive demand for tin stems from a massive gap in usage between AI servers and traditional servers. Driven by massive capital expenditure from US and Chinese cloud giants (AWS, Azure, GCP, Alibaba, Tencent, ByteDance), global AI server shipments are projected to hit 2.13 million units in 2025 and exceed 4 million by 2026. Consequently, data indicate that AI sectors now drive 60–70% of the growth in global tin consumption (including servers, AI PCs, optical modules, advanced packaging etc.), cementing its status as a core computational metal. Data Source: SMM II. Unit Tin Consumption in Computing Scenarios — Volatile Upward Trend and Long-Term Plateau Understanding the demand resilience of tin in computing scenarios requires clarifying a key premise: Over 90% of tin in computing applications exists as solder, primarily lead-free systems such as tin-silver-copper alloys SAC305 and SAC105. This metric dictates two core logics. First, in the board-level soldering process, there is no mature path for aluminum materials or optical interconnect technologies to directly replace tin-based solder. The physical and chemical properties of tin, including a low melting point, high conductivity, and reliable wettability, possess structural rigidity in electronic soldering scenarios. Second, in the short to medium term, HBM stacking increases solder joint density. Even if hybrid bonding scales up in certain advanced packaging after 2030, it will only form localized substitution. Overall, the unit tin consumption curve presents a pattern of a volatile upward trend followed by a long-term plateau: Data Source: SMM → 2025 to 2027: Rapid Upward Phase in Unit Consumption The current phase features a steep increase in unit tin consumption for AI servers. Three parallel technological drivers are overlapping during this period. Jump in PCB Layer Count and Area: AI server motherboard layer counts have increased from the traditional 8 to 12 layers up to 16 to 20 layers, and sometimes 30 layers. The PCB area has reached 3 to 5 times that of traditional machines. Multilayer boards result in a geometric increase in solder joints. Based on high-end AI server motherboard configurations, the incremental tin usage related to PCBs for a single AI server can reach up to approximately 1.32 kg. Generational Upgrades in HBM Stacking: As HBM3E advances to HBM4, the stacking layer count evolves from 8Hi to 12Hi and 16Hi. The number of micro-bumps between a single GPU and HBM reaches the hundreds of thousands, with spacing narrowing to 10 to 15 μm. The usage of BGA solder balls increases multiplicatively with I/O density. Each additional HBM stacking layer adds thousands to tens of thousands of micro-bumps, and every connection consumes tin-based solder. Leaps in Optical Module Speeds: 800G and 1.6T optical modules are entering a period of scaled production. The internal pad spacing of high-speed optical devices is only tens of micrometers, requiring specialized solder paste made from Type 4 to Type 8 ultra-fine tin powder. Although the tin consumption of a single optical module is small, in a 10,000-card intelligent computing center, optical modules are counted in the tens of thousands, providing clear elasticity in total volume. → 2028 to 2029: Unit Consumption Enters a Plateau During this period, the growth of tin consumption will be driven more by the scale of installation volumes. Post-2028, the upward momentum of unit tin consumption is expected to weaken marginally. The penetration rate of integrated AI rack architectures, such as NVL72 and GB200, is projected to rise from approximately 32.5% in 2026 to about 53.8% in 2030. After Scale-Up architectures replace a portion of traditional 8-GPU servers, the tin consumption per rack is expected to stabilize roughly in the 3.7 to 4.7 kg range, lacking clear upward catalysts. In advanced packaging, Chiplet and 2.5D/3D CoWoS continue to penetrate, but tin usage for single-chip micro-bumps is already approaching the tens of grams level, slowing the marginal increment. → Post-2030: The Primary Downward Risk Path is Hybrid Bonding In current technological roadmaps, Hybrid Bonding technology poses a potential downward risk to tin consumption. This technology removes tin-silver solder caps and adopts direct copper-to-copper bonding, theoretically reducing a portion of tin usage in the packaging process. However, its actual impact requires objective assessment. Hybrid bonding is currently applied only in the most advanced process nodes, such as the back-end of HBM4+ and CIS image sensors. Scaled production is expected after 2030, and the penetration speed depends on yield improvements and cost convergence. The key constraint is that board-level SMT soldering , which accounts for approximately 97% of total AI supply chain tin usage, currently cannot be replaced by hybrid bonding. Board-level soldering involves the electrical connection of thousands of components across the entire board, relying heavily on reflow soldering with solder paste and wave soldering with solder wire. These processes do not yet have a direct copper-to-copper replacement route. Therefore, even if hybrid bonding gradually penetrates the advanced packaging sector, its impact on total tin consumption will be largely confined to the chip packaging stage, accounting for roughly 5% to 12%, rather than causing a systemic demand shock. Data source for these projections is SMM. III. Tin Material Categories and Supply Chain Validation Data Source: SMM Based on SMM data, the market is divided into the following categories: 1. Solder Paste: Approximately 50% to 55% Solder paste is the main consumable for SMT. Both AI server motherboards and optical module PCBs use solder paste reflow soldering as the core process. High-end categories are SAC305 (Sn96.5/Ag3.0/Cu0.5) and SAC105, which comply with RoHS lead-free requirements. Ultra-fine powder specifications, from Type 4 to Type 8, are used for microscopic optical module pads. This is currently the specification with the tightest production capacity, reflecting new requirements for tin powder processing precision driven by computing upgrades. 2. Preformed Solder Preforms and Solder Wire: Approximately 20% to 25% These are used in processes like wave soldering, manual rework, and optical module shell sealing. The consumption per rack is not large, but the total volume grows linearly with installation scale. This is a volume-driven category with relatively moderate price elasticity. 3. BGA Solder Balls (6N High-Purity Tin): Approximately 15% to 20% This is the core consumable for GPU, HBM, and CPU packaging ball placement, holding the highest unit price among all tin material categories. The number of BGA solder balls on a single high-end AI chip ranges from thousands to tens of thousands. The supply landscape for 6N high-purity tin is highly concentrated. Tin Industry Shares holds the largest global market share, with Malaysia Smelting Corporation and Yunnan Chengfeng serving as primary supplementary suppliers. The growth of this category benefits from both the increase in AI chip shipment volumes and the continuous rise in single-chip solder ball density caused by HBM stacking increasing I/O density. This classifies it as a category with simultaneous growth in volume and price. 4. Tin Bars and Tin Anodes: Approximately 5% to 10% Tin anodes are used in the PCB electroplating process. The tin consumption for electroplating increases with high-layer-count AI server boards. Compared to other categories, the technical barriers and added value of tin anodes are low, making it a follower-growth category. IV. Breakdown of Core Tin Usage in Computing Centers Tin consumption in computing centers is concentrated in several clear segments. PCB board-level soldering is the absolute primary driver. Advanced packaging offers the highest growth elasticity despite its limited total volume proportion. Tin usage in power supply and distribution is extremely limited. The details are as follows. PCB Board-Level Soldering: 85% to 92% All components on AI server motherboards, which have 16 to 30 layers and 3 to 5 times the area of traditional machines, are electrically connected via SMT and wave soldering. From GPU chips to surface-mount capacitors and resistors, this process relies entirely on tin-based solder, primarily paste and secondarily wire. Within the incremental tin usage for AI, PCB electroplating and SMT contribute over 97%, acting as the true carrier of tin demand. For example, a 10,000-card AI computing center requires 2.5 to 3.2 tons of PCB solder alone. This indicates that tin consumption during the data center construction cycle features highly concentrated release characteristics. Advanced Packaging (CoWoS/HBM/Chiplet): 5% to 12% Processes such as GPU die-to-substrate bonding, HBM stacking and interposer interconnection, and micro-bumps between Chiplet dies widely use solder balls, micro-bumps, and ultra-fine solder paste made from 6N high-purity tin, which has a 99.9999% purity. The packaging tin usage for a single high-end AI chip can reach tens of grams, and the premium for 6N high-purity tin is significantly higher than that of standard tin ingots. Statistics show that the chip segment, including advanced packaging and EUV lithography, accounts for only 2% to 3% of the total AI supply chain tin consumption. However, its leading growth rate and high unit price present a structural opportunity for the tin industry. Currently, major suppliers of 6N high-purity tin include Tin Industry Shares, Malaysia Smelting Corporation (MSC), and Yunnan Chengfeng, reflecting a highly concentrated supply landscape. 800G and 1.6T High-Speed Optical Modules: 2% to 5% The interconnection of optical chips, lasers, and detectors with optical module substrates requires ultra-micro solder paste to achieve micrometer-level precision soldering. Optical module shell sealing and conductive soldering for high-speed connectors also use tin-based solder preforms. The upgrade from 800G to 1.6T means pad spacing shrinks further, ensuring continued demand growth for ultra-fine tin powder specifications of Type 6 and above. Power Supply, Distribution, and Grounding: Under 1% Only the auxiliary solder joints in data center low-voltage distribution cabinets, UPS systems, and grounding copper grids use a small amount of solder. This does not constitute a main consumption scenario for tin. The proportion of the power distribution segment in total tin consumption is small. Tin's role in the computing chain is essentially connection rather than transmission, making the solder joint the true carrier of tin. V. Conclusions First, the pull of AI computing expansion on tin consumption is structural rather than cyclical. Traditional servers consume about 0.5 kg of tin per unit, whereas AI servers have reached 4 to 5 kg. This 8 to 10-fold jump is a reconstruction of the demand function rather than a gradual upgrade. SMM forecasts a 24% CAGR for global newly installed computing capacity from 2025 to 2030. This growth rate, combined with the continuous rise in per-unit consumption, indicates that tin's consumption elasticity in the AI computing chain will be noticeably higher than that of most industrial metals. Second, PCB board-level soldering is the absolute primary demand source for tin in AI computing. PCB board-level soldering accounts for 85% to 92% of AI tin usage. From an incremental perspective, PCB electroplating and SMT placement contribute over 97%. A 10,000-card AI computing center requires 2.5 to 3.2 tons of PCB solder alone, while the power supply and distribution segment accounts for less than 1%. Tin's role in the computing chain is essentially connection rather than transmission. Solder is the fundamental identity of tin and the root source of its demand resilience. Third, the unit tin consumption curve moves upward in the short term, plateaus in the medium term, and faces structural substitution risks in the long term, though the substitution scope is limited. The years 2025 to 2027 represent a rapid upward phase for unit consumption, driven by increased PCB layers, HBM stacking, and optical module speeds. The years 2028 to 2029 enter a plateau phase as Scale-Up architectures lock in per-rack tin usage. Post-2030, hybrid bonding may form localized substitution in the advanced packaging segment, which accounts for 5% to 12% of AI tin usage. However, board-level SMT soldering, holding the absolute majority share at roughly 97%, has no substitution path. Finally, there is distinct divergence among tin material categories. Solder paste, accounting for 50% to 55%, benefits from PCB area expansion and layer count increases, categorizing it as a volume-driven product. BGA high-purity solder balls, accounting for 15% to 20%, benefit from increased chip packaging density and the 6N premium, classifying it as a volume-and-price growth product. Preformed solder preforms and tin anodes are follower-growth categories. Within the AI computing investment cycle, solder paste and BGA solder balls are the categories with the highest elasticity. Overall, tin's position within the computing metal narrative is systematically undervalued by the market. While the hardware demand for computing infrastructure has been fully priced in, tin serves as the computational solder. From server motherboards to chip packaging and optical module interconnections, it covers the interconnection needs of nearly every key link in AI hardware. The re-evaluation of its value has just begun.

[SMM Tin Morning Brief: The most-traded SHFE tin contract opened lower in the night session and then maintained a sideways consolidation pattern, while downstream in the spot market primarily engaged in just-in-time procurement]

“Tin” Leads the Future: Industry Transformation and Value Reshaping in the New Cycle Conference Background At present, the global tin industry is standing at a historic turning point. Traditional cycle logic has been completely disrupted, and tin’s strategic value has become fully evident. In 2026, the tin market is showing an unprecedentedly complex landscape and profound changes: I. Deep Restructuring of the Supply-Demand Pattern, with Strategic Attributes Elevated to an Unprecedented Level The global static reserve-to-production ratio for tin resources is only 14 years, and scarcity is becoming increasingly prominent. The supply side is facing “triple pressure”: repeated twists and turns in Myanmar’s production resumptions, continued tightening of Indonesia’s policies, and elevated geopolitical risks in the DRC—resource constraints have become the new normal. Meanwhile, the demand structure has undergone a fundamental shift, and tin has become a strategic resource linking traditional manufacturing with the digital future. II. The Pricing System Breaks Through History, and the Industry Ecosystem Faces Reshaping In early 2026, SHFE tin prices broke through 470,000 yuan/mt, hitting a record high. This price breakthrough is not only a reflection of the supply-demand imbalance, but also a sign of value re-rating in the tin industry. Traditional trading models, risk management systems, and supply chain collaboration approaches are all in urgent need of innovation and breakthroughs. III. Technology-Driven and Green Transformation Gives Rise to a New Symbiotic Ecosystem Digital and intelligent technologies are deeply empowering the tin industry chain. Global green transformation requires the tin industry to upgrade toward low-carbonisation and a circular economy; recycled tin recovery and green smelting processes have become the only way forward. All links of the industry chain must shift from competition to collaboration, building an open, resilient, and innovative symbiotic system. Against this backdrop, August 19-21, 2026 in Changsha, Hunan , the 2026 SMM (16th) Tin Industry Chain Conference will bring together global industry elites for joint discussions. Dongguan Xingshibo Environmental Protection Engineering Co., Ltd. will attend this grand event to discuss industry development trends with industry peers and work together to drive the tin industry to new heights. Click to register for the conference now, and jointly witness and participate in this extraordinary and far-reaching industry event to create a brilliant new chapter together! Xingshibo focuses on the recycling and utilization of waste tin resources and the supply of solder products. Centered on slag, tin dross, tin ash, tin sludge, solder paste residue, tin-containing blocks, and solder scrap, it has established an integrated service system covering sampling and detection, recovery evaluation, processing and batching, and finished product supply. The company adheres to stable quality, transparent pricing, timely delivery, and flexible cooperation as its core, providing reliable comprehensive tin resource service solutions for solder materials, metal processing, trade circulation, and related precision clients. CIEXPO specializes in waste-tin resource recycling and solder product supply. We handle tin dross, ash, sludge, paste residue, tin ingots and all solder scrap — providing an integrated service from sampling & assay through recovery evaluation, processing and finished goods supply. Core commitment: consistent quality, transparent pricing, timely delivery and flexible cooperation. Contact Information Zhou Teng 139 0292 9039 kevin@ciexpo-ele.com Press and Hold to Scan the Code to Register Now 2026 SMM (16th) Tin Industry Chain Conference

In June, market expectations for US Fed interest rate hikes heated up, driving the US dollar index up more than 2% for the month. This coincided with the electronics industry entering the traditional off-season and weak end-use demand, while doubts lingered over the sustainability of the AI sector rally. Profit-taking on earlier high-price positions intensified, and these combined factors dragged tin prices lower. SHFE tin fell 7.08% in June, while LME tin dropped 6.68% over the same period. Since the start of July, comments from Warsh at the Sintra Forum that "inflation expectations have declined over the past four weeks, and inflation risks have also diminished," together with US June non-farm payrolls data missing expectations, have cooled market expectations for US Fed rate hikes. At the same time, tech stocks rebounded. These multiple positive drivers pushed tin prices to drift higher in early July. As of around 16:51 on July 6, LME tin was up 1.26% to $52,970/mt, with its month-to-date July gain at 2.56%; SHFE tin was up 3.09% to 410,360 yuan/mt, with a 5.4% month-to-date rise. Spot Market Tin prices fell over 8% in June; spot prices rose for consecutive days in July but wait-and-see sentiment prevails Spot tin prices: SMM #1 tin spot price rose for four consecutive days, with the July 6 quote at 406,900-415,300 yuan/mt and the average price at 411,100 yuan/mt, up 2.96% from the previous trading day. As tin prices rebounded, wait-and-see sentiment intensified in the spot market. Only some rigid demand purchases were made, and overall market trading activity was subdued. Looking at the monthly trend, the average spot price of SMM #1 tin stood at 387,800 yuan/mt on June 30, compared with 425,000 yuan/mt on May 29—a drop of 37,200 yuan/mt, or 8.75%, in just over a month. Notably, as tin prices fell to around 380,000 yuan/mt, downstream restocking demand saw a phase of release. Fundamentals ►Production: Refined tin production edged up MoM in June According to SMM data based on market communication, China's refined tin production edged slightly higher MoM in June 2026, with overall output remaining relatively stable. The slight rise in June refined tin production was driven by two main factors. Supply side, raw material availability showed marginal improvement: earlier overseas tin ore import increases became more evident, and while production resumptions at Myanmar mines were slow, ore continued to flow out, somewhat easing tightness in domestic raw materials. On the other hand, rising arrivals of imported ore at ports drove smelting TCs higher, bringing a phase of relief to the prolonged raw material tightness and creating conditions for smelters to raise operating rates and boost output. However, subsequent production expansion faces multiple constraints: May to July is the traditional rainy season in Myanmar, which limits open-pit mining operations and ore transportation, leading to expectations of a MoM pullback in short-term imported ore arrivals. Overall, the refined tin supply-side is marginally loose at the current stage, but downstream industries are entering the traditional consumption off-season. With both supply and demand weakening, output is unlikely to see a significant surge in the short term. ► Imports: Tin ore imports rose both YoY and MoM in May, with imports from Myanmar surging 384.5% YoY. China's tin ore imports in May were 16,800 mt (equivalent to about 6,408 mt in metal content), up 7.07% MoM and 25.61% YoY, an increase of 1,221 mt in metal content from April (which was equivalent to about 5,187 mt in metal content). Cumulative imports from January to May were 85,900 mt, up 71.41% YoY. China's tin ingot imports in May were 1,838 mt, down 34.4% MoM and 11.46% YoY, with cumulative imports from January to April at 11,196 mt, up 17.75% YoY. Trade data for the tin industry chain from 2025 to May 2026 show the global tin market's supply-demand pattern is undergoing significant structural adjustment, characterized by accelerating supply recovery from overseas mines, easing domestic raw material supply pressure, and downstream smelting increasing supply due to lower raw material costs, while weak overseas demand hinders exports. On the raw material supply side, cumulative tin ore imports from January to May 2026 reached 85,998 mt, surging 71.41% YoY, with May imports alone at 16,831 mt, up 7.07% MoM and soaring 25.61% YoY. This strong rebound was mainly driven by the recovery of Myanmar ore, with tin ore imports from Myanmar reaching 6,634 mt in May, surging 384.5% YoY, and cumulative YoY growth from January to May soaring to 203.49%; in contrast, while tin ore imports from countries outside Myanmar maintained a cumulative positive growth of 34.72%, May single-month volumes still fell 15.23% YoY, indicating a relatively moderate supply recovery from non-Myanmar sources. ► Inventories: SMM weekly tin ingot social inventory across three regions declined for four consecutive weeks. China tin ingot social inventory: According to SMM statistics, as of July 4, 2026, total tin ingot social inventory across three regions in China stood at 7,299 mt, down sharply by 1,374 mt from 8,673 mt the previous week (June 26), a decline of 15.84% WoW. Looking at the trend, since hitting a near-term peak of 13,604 mt in early June, China's tin ingot social inventory has declined for four consecutive weeks, with cumulative destocking over the past month reaching as high as 46.4%. The destocking slope exhibited a "gradual then steep" pattern, and the current inventory level has pulled back to a year-to-date low, signaling marked marginal improvement in the market supply-demand pattern. By region, inventory in Shanghai dropped to 3,750 mt, a weekly decline of 996 mt, contributing 72.5% of the total weekly destocking and making it the dominant force in this round of destocking, reflecting accelerated trade flows in east China and a substantial rebound in downstream purchase willingness. Inventory in Guangdong also declined to 3,449 mt, down 378 mt WoW, accounting for 27.5% of total destocking, confirming that downstream rigid demand in south China, represented by solder enterprises, remained resilient and the pace of stockpiling accelerated. Analyzing the underlying logic, on the one hand, it was driven by restocking after price pullbacks. The dampening effect of previously high tin prices on downstream purchases gradually faded as prices returned to rational levels recently, and pent-up rigid orders were released in a concentrated manner, accelerating the digestion of visible inventory. LME tin inventory: On June 30, LME tin inventory data stood at 8,575 mt, compared to 8,850 mt on May 29, indicating that LME tin inventory declined in June. SMM Outlook On the macro front, a number of macro events in and outside China will continue to disturb tin price movements in July. Outside China, key focus will be on US CPI and PCE inflation data, as well as the US Fed's interest rate meeting at month-end. Earlier, Walsh said that inflation risks have receded, and coupled with the June non-farm payrolls data falling short of expectations, market bets on rate hikes have temporarily cooled. If subsequent inflation data rebounds again and the Fed releases a hawkish tone, a stronger US dollar will suppress tin price trends; conversely, if easing expectations continue, they will provide valuation support for tin prices. At the domestic level, the central bank increased liquidity injections, ultra-long-term special government bonds were steadily implemented, and stimulus policies related to technological transformation of high-end manufacturing and equipment renewal gradually took effect, which are positive for the consumption of tin downstream industries such as semiconductors, AI computing power, and new energy in the medium and long term. However, the weak pattern of the electronics industry during the off-season is hard to reverse quickly in the short term, and the pace of policy dividend releases regarding domestic demand will directly determine the intensity of downstream spot restocking. Fundamentals: On the supply side, the overall tight supply situation of tin ore remained unchanged, but marginal increase signals increased. Smelters maintained stable production with no large-scale production cuts for the time being. On the demand side, entering the traditional consumption off-season, downstream solder enterprises were generally cautious in procurement, and the market relied solely on rigid demand purchases, with high prices significantly dampening purchase willingness. On the inventory side, tin inventories both in and outside China maintained a destocking trend, providing inventory support for tin prices. In summary, changes in macro expectations combined with the performance of the technology sector will affect the fluctuation range of tin prices. Tight ore supply and low overall inventory formed strong fundamental bottom support, acting as a floor for tin prices. However, the sluggish demand during the current off-season will continue to drag on futures, limiting the upside room for tin prices. Looking ahead, it is crucial to closely track US Fed policy direction, the sentiment of the semiconductor industry chain, and continuously monitor the pace of destocking in and outside China. Only when there is a substantial recovery in demand can it provide new upward driving force for tin prices. Recommended reading:

[SMM Tin Morning Update: Macro Tailwinds Keep Emerging, SHFE Tin Surges, Spot Tin Trading Recovers]

[SMM Morning Brief: After Catch-Up Decline, Market Shifts to Wild Swings as Tight Ore Supply Provides a Floor and Macro Headwinds Intensify the Tug-of-War]

"Tin" Guiding the Future: Industrial Transformation and Value Reshaping in a New Cycle Conference Background Currently, the global tin industry stands at a historic turning point. Traditional cyclical logic has been completely disrupted, and strategic value has become fully prominent. The tin market in 2026 presents unprecedented complexity and profound changes: I. Deep Restructuring of Supply-Demand Patterns, Unprecedented Strategic Significance The global static reserve-to-production ratio for tin resources is only 14 years, making scarcity increasingly evident. The supply side faces "triple pressures": recurring delays in production resumptions in Myanmar, persistently tightening policies in Indonesia, and elevated geopolitical risks in the DRC. Resource constraints have become a new normal. Meanwhile, the demand structure is undergoing a fundamental shift, as tin has become a strategic resource connecting traditional manufacturing with a digital future. II. Price Levels Breaking Historical Records, Industrial Ecosystem Facing Reshaping In early 2026, SHFE tin prices exceeded 470,000 yuan/mt, reaching an all-time high. This price breakthrough not only reflects supply-demand imbalances but also signals a revaluation of the tin industry's worth. Traditional trading models, risk management systems, and supply chain collaboration methods are all in urgent need of innovation and breakthroughs. III. Technology-Driven and Green Transformation Fostering a New Symbiotic Ecosystem Digital and intelligent technologies are deeply empowering the tin industry chain. The global green transition demands that the tin industry upgrade toward low-carbon operations and a circular economy. Recycled tin recovery and green smelting processes have become essential paths. All segments of the industry chain must shift from competition to collaboration, building an open, resilient, and innovative symbiotic system. Against this backdrop, the 2026 SMM (16th) Tin Industry Chain Conference will convene global industry elites for joint discussions on August 19-21, 2026, in Changsha, Hunan. Guangdong Huize Metals Trading Co., Ltd. will attend this grand event, joining industry peers in exploring development trends and jointly propelling the tin industry to new heights. Click the registration form to sign up now and witness and participate in this momentous, far-reaching industry gathering, co-creating a brilliant new chapter! Guangdong Huize Metals Trading Co., Ltd., located in Guangzhou—the core hub of the Guangdong-Hong Kong-Macao Greater Bay Area—is a specialized trader focused on tin ingot trade. Since its establishment, the company has deeply cultivated the tin sector, based in South China while serving the entire nation, committed to providing upstream and downstream clients with high-quality, efficient, stable, and compliant metal trading and supply chain supporting services. We have established long-term, stable partnerships with numerous renowned smelters, tin ingot producers, and traders nationwide, forming a strong partner network and serving as a premium supplier to multiple state-owned enterprises and well-known companies. The company is also a member of the Tin Branch of the China Nonferrous Metals Industry Association (CNIA) and a member of the Electronic Tin Solder Materials Branch of the China Electronic Materials Industry Association. Our company has always adhered to the principles of people-orientation, integrity, pragmatism, and innovation, and is willing to achieve mutual benefits and win-win outcomes with partners and clients across the upstream and downstream sectors of the tin industry chain. Contact Information Xie Zhichao: 13197537999 Wang Yongfu: 18889929433 Address: Room 1601, No. 4, Huitong Third Street, Nansha District, Guangzhou Long press or scan the code to register now 2026 SMM (16th) Tin Industry Chain Conference

[SMM Tin Morning Brief: 400,000 Curse Hard to Break, Wait-and-See Sentiment Heavy in Tin Market Pre-Holiday]

[SMM Morning News on Tin: Macro Headwinds Weigh on Tin Prices, Retreat After Rapid Rise; Spot Cargoes Plunge Into "High Prices Suppressing Demand" Dilemma]

[SMM Tin Morning Report: Rate Hike Expectations Surge, Heavily Hitting Non-Ferrous Metals. SHFE Tin Rebound Aborts, Returning to 390,000 for a Tug-of-War.]